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Title Principal Application Engineer
Target Location US-MN-Chanhassen
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Candidate's Name , MSEEChanhassen, MN,PHONE NUMBER AVAILABLELinkedIn ProfileEMAIL AVAILABLEABOUTInnovatedElectrical Test Application Engineerwithextensive experience on electrical test system integration, verification and modification.Proficientin analog and digital signal characterization. Skilled in bench setup and testing, automation measurement and data collection with lab equipment. Exceptional experiment design and test planning, problem solving, and data presentation capability. Delivered validation and qualifications of multigeneration (three) test systems in the fast-paced data storage industry. Led and directed international cross-functional teams for technology transfer and factory implementation. Passionate about cutting-edge test system development, signal integrity, data analysis, and failure investigation. Excellent ability to grasp new technology and ideas in the engineering field. Proficient in synthesizing customer requirements with technical constraints and delivering pragmatic solutions throughmultidisciplinarycollaboration. AREAS OF EXPERTISEDesign of Experiments and Test Plan Bench Setup and Testing RF Signal Characterization Automation Measurement and Data Collection Research and Development System Integration and Optimization Verification and Validation testing Technical Leadership and Mentoring Design for Reliability Trade-off Analysis Root Cause Analysis Feasibility Studies Statistical Analysis Design for Six SigmaTECHNICAL SKILLSProgramming Skills:Lab Equipment:Python, MATLAB, SQL, JMP, Linux, MS Office, Minitab, Visual Basic Oscilloscopes (DSO,MSO etc).,Arbitrary Waveform Generator (AWG),Vector Network Analyzer (VNA),Signal Analyzer (SA),Function Generator,Digital Multimeter (DMM)Engineering Tools:JIRA, Cadence AllegroEXPERIENCEPrincipal Application Engineer,Marvell SemiconductorInc., MN 08/2024  Present Functional and performance validation on HDD preamp chip for customer sample bring up. Identified and resolved signal integrity issues in the latest preamp design, collaborating with the design team on root cause analysis. Performed analog and digital signal characterization, including gain/bandwidth sweeps, noise measurements, eye diagram, jitter test and serial interface testing on preamp chips with PCB test board. Automated bench test measurements and data collection using PyVisa, integrating oscilloscopes, AWGs, VNAs, SAs, and DMMs. Established and equipped a new lab for design verification testing at the MN facility. Senior Staff Engineer,Seagate Technology, Bloomington,MN 08/2010  06/2023 Validated and qualified two generations of read-write channels on SoC for component-level test in R&D and manufacture.Page1 Characterized and comparative studied on Preamps from different vendors for spinstand testing and the results led to the plan of record decision for component testing. Engaged in developing in-situ component test platform in drive environment for better alignment test integrity from wafer level to drive. Developed and coded test algorithms to seamlessly adapt to the new test environment. Performed bench probing and characterization to ensure signal fidelity on PCB design validation for the new test system platform. Coordinated withcross-disciplinaryteams to benchmarkand characterize test systems electronics and mechanics for design feasibility and verification. Evaluated and integrated commercial test systems with in-house testers. The tracking capability was improved two-fold and the combined system has become the primary test system in production. Led communications with suppliers regarding requests and specifications by adding more test capabilities to serve new-generation technology requirements. Designed prototypes, studied feasibility, and demonstrated engineer bench test tools for failure analysis by combining commercial electronics with hard drive electronics for component-level testing.Staff Engineer, Seagate Technology, Bloomington, MN 08/2005  07/2010 Pioneered the first-generation nanoscale electrical head fly height measurement and established the company standard on electrical head fly height measurement. Invented new electrical tests that are still used for component stability screening based on failure analysis of product field returns. These tests provide important feedback to the product design team to fix the failure's root cause.Senior Engineer, Seagate Technology, Bloomington, MN 03/2001  07/2005 Established electrical head geometry test as the standard benchmark on a component level to guide head design target. Collaborated with the cross-functional team on test software and firmware qualification on different subsystems. Oversaw the technology transformation and implementation across multiple organizations.Advisory Engineer, Seagate Technology, Bloomington, MN 11/1998  03/2001 Deep dive data analysis with SQL to assess the performance of different product designs, performed characterization tests, and provided feedback with system-level recommendations for performance enhancement.EDUCATIONMaster of Sciencein Electrical Engineering, Universityof Minnesota Master of Sciencein Material Science, Carnegie MellonUniversity Bachelor of Sciencein Applied Physics, Beijing Scienceand Technology University, China AWARDS AND RECOGNITIONS Seagate General Management rewardCandidate's Name , M.S PHONE NUMBER AVAILABLE EMAIL AVAILABLE Page2

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