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Click here or scroll down to respond to this candidateCandidate's Name
Street Address East Chauncey Lane Apt 2029Phoenix, Az Street Address
PHONE NUMBER AVAILABLEExperienceRan and installed electrical cables, chemical lines, vacuum lines, and breaker boxes and their connections to various equipment used both inside and outside the fab.Repaired and rebuilt test equipment tools for both corporate and customer use.Tested and diagnosed issue on printed circuit boards and substrate packagingUsed multimeters and oscilloscopes to diagnose signal and power issues on the boards.Repaired and soldered PC boards using SMT ICs and thru-hole componentsPerformed testing on repaired boards and substrates using spectrum analyzers to make sure the substrates and PC boards met product manufacturing criteria.10+ Years of experience in troubleshooting, maintaining, and repairing using test equipment such as multimeters, oscilloscopes, and various programmable test equipmentCalled on to help other technicians and programmers with solving technical issues faced in repairing and upgrading PCBs.2+ years in motorized automation system upgrades and repairs.4+ years PCB Validation support.6+ years upgrading and repairing automated lab and factory floor equipment for supplying test results for future product development and factory down conditions.6+ years developing macros for Microsoft Office (i.e.: Word, Excel, Access, and PowerPoint)3+ years experience in creating macros for various In-Target Probes to initialize and troubleshoot problems with chipsets, memory, and cache.3+ years onboard trace repair, SMT soldiering, through hole soldering, etc.3+ years experience dealing with Desktop, Laptop, and Server product motherboards.5+ years experience using oscilloscopes, multimeters, regulated power supplies, spectrum analyzers, and function generators to troubleshoot circuits down to component level.3+ years experience reading various circuit schematics and blueprints to help troubleshot boards.Designed and created PC Boards using ultraviolet lighting after applying the photoetching to the board.Designed and collected several test experiments to troubleshoot problems on the factory floor.Installed and assembled fab module equipment for manufacturing wafers to create dies used in outgoing productRecorded fab equipment progress of tool installation on the factory floor.Setup and configured the optics lab layout in order to provide manueverabilty distance between the optic tables and testing benches as well as, providing distance to setup and change the camera configuration, and configurable tray harnesses for cameras and changeable optic lenses..Troubleshot and diagnosed integrated board issues using oscilloscopes, itp analyzers, and multimeters to trace signal and power supply issues on motherboards and other integrated PC boards.Soldered through hole components, surface mount integrated circuits, edge board connectors, as well as signal and power lines using IPC-A610 specifications.Went to several manufacturing sites to investigate and troubleshoot problems that occurred in the manufacturing of substrates and placement of devices in handling media.Worked for manufacturing site that supplied, troubleshot, and repaired PC boards and integrated circuits for use military defense equipment.Setup and configured the visual optical lab for developing and configuring dimensional equipment, research tools and measurement applications for use in fabs in Chandler AZ, Portland OR, Seattle WA as well as, overseas sites in Penang, Costa Rica, and Cavite.Setup several research and development equipment in the optical lab to test Class 4 laser systems and the associated optical lens configuration and orientation in preliminary research and testing substrate C4 bump layout and imperfections.Helped one of the manufacturing sites in Japan with setup and configuration issues in developing substrates in their manufacturing site.Developed and troubleshot manufacturing handling media for using in the production line.Developed software applications in C/C++, Visual Basic, Labview, Matlab, Python, and Cognex Vision-ProDecreased manufacturing defects that occurred in the production line floor by implementing new holding tray fixture designs.Work ExperienceField Service Engineer August 2022 June 2024Tokyo Electron LTD23751 N 23rd Avenue #190Phoenix, Az 850851.Installed mounting blocks, seimsic plates on sub-fab equipment (THC and COT), as well as attached, routed and leveled fab equipment (HCSB, CSB, PRB-F, PRB-B, and IFB).2.Ran, attached and dropped electrical cables and chemical lines to fab and sub-fab equipment3.Recorded pass-downs for fab and sub-fab equipment in AZ and OR.4.Updated GANNT charts and stored PPAC information on the network in their designated locations.5.Emailed updated installation of equipment to the customer and created Powerpoint charts for presentation of updated installation progress of fab and sub-fab for each new tool installation.Lab Testing Technician August 2020 June 2022Intel Corporation5000 West Chandler BlvdChandler, Az 852261.Tested substrate bump height and spacing on substrate and die chip packages2.Tested carrier and JEDEC tray handling media for flatness, pocket height, x and y pocket position and spacing, and overall length, width, and height of tray and procket size.3.Collected and packaged up substrates and handling media to other supplier and factory floor locations.4.Diagnosed material manufacturing problems and issues with handling media and substrate and die manufacturing.5.Performed electrical testing on substrate chips for product deformation.Product Test Technician September 2019 Jan. 2020Intel Corporation5000 West Chandler BlvdChandler, Az 852261.Tested and diagnosed issue on printed circuit boards and substrate packaging2.Used multi-meter and oscilloscopes to diagnose signal and power issues on the boards.3.Repaired and soldered PC boards using SMT ICs and thru-hole components4.Performed testing on repaired boards and substrates using spectrum analyzers to make sure the substrate and PC-boards met manufacturing criteria.Test Reliability Engineer January 2001 August 2018Intel Corporation5000 West Chandler BlvdChandler, Az 852261.Wrote programs for metrology measurement machines to test substrates, integrated circuits for height, width, flatness and bump coplanarity.2.Met with handling media suppliers to address and resolve manufacturing issues with their product.3.Developed metrology programs to test handling media and substrates before the product was used on the production line floor4.Met with suppliers to resolve manufacturing problems that occurred on their production line.5.Met with production line managers and personnel to fix issues on substrate and die bonding problems on the production line floor.PC-Board Repair Technician August 1995 Dec. 2000Intel Corporation6501 West Beck RoadChandler, Az 852261.Diagonalized and repair motherboards, server-boards, and PC boards using oscilloscopes, ITP, and multimeters.2.Soldered SMT components and thru-hole components on motherboards.3.Developed a C program to record problems and test board station, MAC-Address and IP-Address of the network card being used.4.Trained new repair technicians how to diagnose and troubleshoot motherboards5. Repaired 12 out of 16 motherboards that were troubleshot numerous times in 12 hoursEducationBachelors of Science in Electrical EngineeringMajor: Digital and Analog Circuit DesignArizona State University |
