Candidate Information Title Engineer Process, operations, equipment maintenance, metrology Target Location US-OR-Portland Email Available with paid plan Phone Available with paid plan	20,000+ Fresh Resumes Monthly     View Phone Numbers     Receive Resume E-mail Alerts     Post Jobs Free     Link your Free Jobs Page     ... and much more Register on Jobvertise Free
Search 2 million Resumes Keywords: City or Zip:	Related Resumes

Cell Phone: PHONE NUMBER AVAILABLE E-mail: EMAIL AVAILABLE

CAREER SUMMARY
20 years  experience in the semiconductor industry providing process engineering, metrology and equipment expertise in manufacturing, research & development and quality control environments.

WORK EXPERIENCE
Operations Manager, Indoor Goals Arena Beaverton, OR 09/14   present
Manage arena for sporting events and parties. Responsible for booking rentals, registering league participants, coordinating and setting up sporting events, updating and maintaining stats database and webpage, scorekeeper, referee, concession operator and general maintenance.

Staff Engineer (Etch), Jireh Semiconductor Hillsboro, OR 05/12   07/14
Oversaw oxide, metal etch and outgoing wafer quality control. Setup, monitored and defined limits for CD, depth and thickness metrology. Standardized CD measurements.
Developed and implemented optimized in-situ wafered and waferless cleans to improve oxide etcher mean time between cleans by 150% and reduce defectivity by 10x.
Optimized metal and pad etch processes to improve process repeatability, tool utilization & uptime and correct a backend plate up issue saving 4000/qtr reject wafers.
Assessed EOL PT data, inline SPC and equipment down issues and implemented procedural changes to increase line yields 2-8% and tool uptime from 65 to 85%.

Yield/Defect Engineer, ON Semiconductor, Gresham, OR 10/10   05/12
Performed root cause analysis of edge engineering issues such as chips, breaks and scratches, standardized defect trends for all technologies and out-going quality control.
Evaluated defectivity trends real time and implemented tool/process restrictions. Worked with process engineering groups to resolve chronic issues in the CVD, Implant, Etch, CMP and Litho areas and resolved fab airborne contamination issues.
Updated defect database and educated technicians on expedient determination of likely defect source during a process excursion. Main backup contact for all in-fab defect issues.
Reviewed and updated defect limits based on EOL yield data and SPC guidelines.

Senior Process Engineer (Etch), Maxim Integrated Products Beaverton, OR 05/04   10/10
Oxide and metal etch engineer. Reduced inline and end of line scraps and discrepant material rejects, improved inline and parametric CPKs, increase tool utilization and availability.
Optimized trench etch on SOI wafers to improve profile & alleviated a wafer discharge issue that resulted in tool downtime.
Standardized optical thin film metrology measurements.
Process development for new device integration including Cu metallization and BAW devices.

Field Service Engineer, Tokyo Electron America Hillsboro, OR 01/03   05/04
Maintained, troubleshot and repaired TEL Unity II and Telius SCCM etchers.
Tracked MTBF, MTTC, etc.  and reduced downtime 3%, tracked critical spares and setup a troubleshooting database.

Chemistry Instructor, Portland Community College Portland, OR 09/02   04/03
Lectured, supervised and evaluated classroom and laboratory assignments.

Sr. Process Engineer (litho & etch), IDT Hillsboro, OR 06/97-10/01
Litho: Standardized CD metrology & calibration, converted electrical inline CDs to optical CDs.
Oversaw a resist conversion project to improve process latitude and reduce costs.
Etch: Optimized ash eliminating the need for 10 additional ashers and increasing
throughput by 30%.
Optimized solvent strips to reduce defect levels 3x and improve tool utilization by 20%.
Standardized thin film measurements and implemented calibration procedures.

Lithography Process Engineer, Nortel Ottawa, Ontario, Canada 01/95 - 05/97
Developed and demonstrated 0.1 um printing and etch for DFB laser array fabrication.
Evaluated phase shift masks for DFB laser arrays with modelling and print verification.
Designed and modified a contact aligner for off-axis illumination of phase shift masks.
Demonstrated holography for laser array (0.1um) and SAW device (0.25um) lithography.
Evaluated and implemented a new resist with BARC process and modified holographic optics to increase yields from 2% to >20% on discrete DFB lasers.

Development Engineer, Nortel Ottawa, Ontario, Canada 01/92 - 12/94
Developed patterning schemes for ferroelectric related materials by wet and dry etching.
Evaluated and purchased a plasma etcher for patterning ferroelectrics.
Designed a test mask set to evaluate PZT integration on Si ICs for NV-DRAM.
Prepared and optimized formulations and characterized spin-on techniques to prepare films of ferroelectric PZT, conducting RuO2 and inorganic resist/H2 barrier materials.
Optimized substrate surface and solution formulation for electroless copper deposition using DOE and demonstrated 0.25 um Cu via fill.

SKILLS
Experienced with LAM 9600/DFM metal etchers, LAM 4400/4520/XL, TEL UnityM and AMAT Centura oxide etchers, AMAT P5000 and DPS poly etchers, Mattson, Aura 1000 and 2000, Axcelis, Gasonics 3510/PEP and ULVAC Phoenix ashers, Fusion 200PCU UVbake, Semitool acid and solvent tools, AME 8115, Tegal 904e, AMAT MarkII, MxP+ and DPS metal and LRC Alliance, SEZ single wafer wet etch and Wet sinks. Experienced with Opal and Hitachi CD SEMs, Tencor UV1x50, Thermawave 2600/5200, ASML, GCA and Canon steppers, Karl Suss contact aligners and SVG,TEL & DNS tracks, KLA 2139, Tencor AIT1, Rudolph August AXI Macro inspection tool, JEOL SEMs / FIB / EDX and KLA-Tencor eV300. Surface analytical techniques (AES,AFM,XRF, IR, Raman), yield enhancement, root cause analysis, failure analysis, BKM methodology, data mining, lean manufacturing, DOE, SPC, FMEA, Gauge R&R, UNIX, ANOVA, Certified in Tregoe Kepner problem solving, 6 sigma. Experience with ISO 9000, ISO 14000, GD&T, SCM and MIL-STD. Experience with Prolith, JMP, eChip, Minitab, Klarity. Vacuum systems, abatement, plasma, lasers, optics, lithography, thin films, PECVD, PVD, metal evaporation and plating, spin on films, RTP, formulations, defect and thin film metrology.

EDUCATION
Ph.D. Chemistry, Carleton University, Ottawa, ON, CANADA, 1996
Thesis title - "Photoinduced Electron Transfer in Chromophore-Quencher Complexes Designed for Metal Centered Chemistry" Thesis Supervisor - Dr. R. J. Crutchley

B.S. Chemistry, Carleton University, Ottawa, ON, CANADA, 1986

PATENTS
Maxim: 7,966,722 Nortel: 6,337,032; 6,066,581; 5,728,603 and 5,358,889

VOLUNTEER
Habitat for Humanity Re-store Beaverton, OR 06/14   present