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Street Address Wakefield Court
Shakopee, MN Street Address
Home: PHONE NUMBER AVAILABLE Cell: PHONE NUMBER AVAILABLE
E-Mail: EMAIL AVAILABLE
OBJECTIVE: Seeking a Process Engineer position. Will offer process
improvement, efficiency, and cost reduction to maintain effective qualities
product.
EDUCATION:
Institute Of Technology
University Of Minnesota
BS Degree, Mathematics
Electrical Engineering Certificate (3 years program)
PROFESSSIONAL EXPERIENCE:
Digi International, Inc. 10/2007-
04/18//2014
Sr. Process Engineer
. Review PCB design and panel layout to make sure designs are
producible, efficient for production, and cost saving. Software
used for review are CAM350 and Valor NPI. Traveled and support for
Digi's contract manufacturing in ThaiLand, Germany and USA on
product transfers and assembly issues.
. Started up production line included: DEK ELA, MYDATA DX100, Heller
1800 Oven, YesTech AOI, Selective Solder NovaStar SPA400.
. Build prototype, pilot runs before outsource the assemblies.
. Set-up and create programs for equipment.
. Write process, work instruction and support solder stencils and
tooling for production.
. Create Manufacture Validation and Control Plan, Defect mapping, SPC,
DPMO, Vendor specification for purchasing and incoming inspections.
. Use CAM350 for Stencil design and ordering. Work with designer on
cavity PCB and design stencil and squeegee blade to make the solder
printable on the cavity PCB for component's placements
. Improved first pass yield from 95% to 98.5%. Responsible for DFM/DFT
reviews and strategies.
Starkey Laboratories, Inc. 11/1996-
10/2007
Sr. Process Engineer
. Build prototype products, study any changes and design for product
manufacturability.
. Set-up and create programs for equipment.
. Write process and support solder stencils and tooling for
production.
. Create Manufacture Validation and Control Plan, Defect mapping, SPC,
DPMO, Vendor specification for purchasing and incoming inspections.
. Evaluate PCB design and component package layout to improve process
yield.
. Use CAM350 for Stencil design and generates Centroid data for Pick
and Place machines.
. Incorporate improvements in packaging to avoid damage in shipping
final circuit boards.
. Process improvement for BGA's solder bumping and solder
interconnects down to 4mil apertures, 8mil pitches for stack die
processes.
. In 1998, saved $110,000 per year in changing materials and process
for circuit boards cleaning.
Rilex Inc. 5/1995-
11/1996
Process Engineer
. As one of the first employees of a start up company, my
responsibilities were to: Create programs and set-up the equipment
for the Surface Mount Technologies (SMT) line include: DEK 249
Screen Printer, Philips Comet and Eclipse Pick and Place machines,
Heller 1800 Oven, H2O Board Wash, Teradyne Tester, Semi-Auto Through
Hole and Wave Soldering equipment.
. Program and run the production from the begin to end products.
. Help customers revises on flex circuit bare board.
. Work on time study, customer quoting, and purchasing materials.
. Create process and quality control forms for the production line.
. Design and ordering stencils and fixtures.
Nguyen Electronics Inc. 9/1992-
5/1995
Process Engineer
. Create programs and set-up equipment for Surface Mount Technologies
(SMT) lines include: Camalot Dispenser, DEK249 Screen Printer,
Dynapert 2200 and Philips 84V Pick and Place, BGK, Dynapert Oven.
. Write process in English and Vietnamese for production line workers.
. Communicate with contract customers to discuss their requirements
for production.
. Train employees on machinery.
. Consult and translate for Vietnamese Employees. Counsel Vietnamese
workers with language and cultural barriers on social and work
related issues on and off the job.
Seagate Technology Inc./Control Data Corp. 10/1988-
08/1991
Test Engineer 2/90-8/91
. Tested the design and development of the Magneto resistive (MR) Head
in the Research and Development Department.
. Managed the Test Fixture, Statistical Process Control (SPC),
Parametric Test, and Fly Height Test.
. Transferred data to VAX and used SQL database to generate data
reports.
. Simultaneously, retained the responsibilities of developing and
maintaining the Paradox3 database as a database programmer.
Database Programmer 10/88-2/90
. Developed a database system for wafer probe, machine, electrical
test and overall data analysis.
. Generated data, graphics and statistical reports for the MR Head
Development Department.
. Interacted with various groups and users.
. Performed application programming using Paradox3, Quattro, Lotus,
3DBoeing Graphics, DOS, PC Tools, Microsoft Word and other
programming tools.
Control Data Corp. 1987-
1988
Maintenance Technician (Lead Tech)
. Maintained and repaired thin film head machines.
. Installed, inspected and operated various automated machines
including: Row Slicer, Bonder, Parallel lapping, and Dicer.
. Executed preventative maintenanceand troubleshooting for electrical
and mechanical production equipment.
. Delegated the work activities. Assisted co-workers with questions
or problems.
COMPUTER SKILLS:
Microsoft Access, Paradox, SQL, Quattro, Excel, Lotus, Pascal, C,
Fortran, UNIX, Novell, DOS, PC Tools, 3D Boeing Graphics, M.S. Word,
AutoCAD, CAM350.
CERTIFICATIONS:
. Certificate in MYDATA DX100, 09/2008
. Certificate in Comet and Eclipse Comprehensive User and Data Prep,
Philips Technology, 12/1995
. Certificate in Quality Focus, Project Focus 10/1997
. Certificate in M.S. Access, Begin and Advanced, 11/1997
. Certificate in M.S. Project 98, 9/2000
. Certificate in Lead Free Soldering, 9/2002
. Certified SMT Process Engineer, 5/2003
. Six Sigma Green Belt, 6/2007
. Member of SMTA and IMAP.
REFERENCES:
Provided upon request.
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