Outgoing Quality Assurance Engineer, TSMC Arizona Corporation, Phoenix, AZ. Establish new outgoing wafer inspection sites, including tools, process/criteria, and inspector training. Develop Outgoing Quality Assurance (OQA) protocols for wafer inspections to ensure standards and protocols are met for final product quality. Responsible for OQA tool (automated visual inspection, original manufacturer, Sorter, packing tools, etc.) release, maintenance, recipe setup and quality control to drive OQA quality improvement projects and big data analytical capability. Engage in cleanroom environmental monitor planning and perform wafer defect failure analysis; root cause analysis; and risk assessment to enhance quality engineering processes and integrated circuit packaging and testing protocols for outgoing quality control.

40 hrs/week, Mon-Fri, 8:30 a.m. - 5:30 p.m.

MINIMUM REQUIREMENTS:

Master’s degree (or foreign equivalent) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or related technical field.

Alternatively, will accept Bachelor’s degree (or foreign equivalent) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a related technical field plus one (1) year of related experience.

Must have education or experience in all the following:

• Project management and project scoping skills, including the Kepner-Tregoe approach;
• Root cause analysis, risk management and Corrective and Preventive Actions (CAPA) implementation;
• Big data analytics using at least 2 of the following: MATLAB; Labview; JMP; Mathematica; or Origin; and
• Quality engineering or manufacturing quality assurance.

Experience may be gained in graduate school.

Please email resume to P_Resumes@tsmc.com and reference Job# 8209.